ISL6612EIBZ
vs
ISL6612IB-T
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Part Package Code |
SOICN-EP
|
SOIC
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
M8.15B
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-10-30
|
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
3
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| Package Description |
|
PLASTIC, MS-012AA, SOIC-8
|
| High Side Driver |
|
YES
|
| Interface IC Type |
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
|
R-PDSO-G8
|
| Length |
|
4.9 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Peak Current Limit-Nom |
|
3 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Voltage-Max |
|
12 V
|
| Supply Voltage-Min |
|
5 V
|
| Supply Voltage1-Max |
|
13.2 V
|
| Supply Voltage1-Min |
|
10.8 V
|
| Supply Voltage1-Nom |
|
12 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3.9 mm
|
|
|
|
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