ISL6612EIB
vs
ISL6612CBZA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
SOICN
Package Description
PLASTIC, SOIC-8
Pin Count
8
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
High Side Driver
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
JESD-609 Code
e0
e3
Length
4.89 mm
Moisture Sensitivity Level
1
3
Number of Functions
1
Number of Terminals
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output Peak Current Limit-Nom
3 A
Package Body Material
PLASTIC/EPOXY
Package Code
HLSOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.68 mm
Supply Voltage-Max
12 V
Supply Voltage-Min
5 V
Supply Voltage1-Max
13.2 V
Supply Voltage1-Min
10.8 V
Supply Voltage1-Nom
12 V
Surface Mount
YES
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Width
3.9 mm
Base Number Matches
4
2
Pbfree Code
Manufacturer Package Code
M8.15
Date Of Intro
2017-10-30
Samacsys Manufacturer
Renesas Electronics
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare ISL6612EIB with alternatives
Compare ISL6612CBZA with alternatives