ISL6612ECB-T
vs
ISL6612IBZ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
RENESAS ELECTRONICS CORP
Part Package Code
SOIC
Package Description
HLSOP, SOP8,.25
Pin Count
8
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
High Side Driver
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
JESD-609 Code
e0
Length
4.89 mm
Moisture Sensitivity Level
1
Number of Functions
1
Number of Terminals
8
Operating Temperature-Max
85 °C
Operating Temperature-Min
Output Peak Current Limit-Nom
3 A
Package Body Material
PLASTIC/EPOXY
Package Code
HLSOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.68 mm
Supply Voltage-Max
12 V
Supply Voltage-Min
5 V
Supply Voltage1-Max
13.2 V
Supply Voltage1-Min
10.8 V
Supply Voltage1-Nom
12 V
Surface Mount
YES
Temperature Grade
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
DUAL
Width
3.9 mm
Base Number Matches
1
2
Factory Lead Time
4 Weeks
Date Of Intro
2017-10-30
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare ISL6612ECB-T with alternatives
Compare ISL6612IBZ with alternatives