ISL6612AIBZ-T
vs
ISL6612EIB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTERSIL CORP
ROCHESTER ELECTRONICS INC
Part Package Code
DFN, SOIC
SOIC
Package Description
SOP, SOP8,.25
HLSOP,
Pin Count
10, 8
8
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
26 Weeks
High Side Driver
YES
YES
Interface IC Type
HALF BRIDGE BASED MOSFET DRIVER
HALF BRIDGE BASED MOSFET DRIVER
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.9 mm
4.89 mm
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HLSOP
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE
Peak Reflow Temperature (Cel)
260
240
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.75 mm
1.68 mm
Supply Voltage-Max
13.2 V
12 V
Supply Voltage-Min
10.8 V
5 V
Supply Voltage-Nom
12 V
Supply Voltage1-Max
13.2 V
13.2 V
Supply Voltage1-Min
5 V
10.8 V
Supply Voltage1-Nom
12 V
12 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3.9 mm
Base Number Matches
2
2
Pbfree Code
Output Peak Current Limit-Nom
3 A
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