ISL6609ACRZ
vs
ISL6605IBZ-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
QFN, SOIC
|
QFN, SOIC
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, PLASTIC, MO-220VEEC, QFN-8
|
SOP, SOP8,.25
|
| Pin Count |
8, 8
|
8, 8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
AND GATE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PQCC-N8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Peak Current Limit-Nom |
4 A
|
4 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Equivalence Code |
LCC8,.12SQ,25
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
|
|
|
Compare ISL6609ACRZ with alternatives
Compare ISL6605IBZ-T with alternatives