ISL6208IBZ
vs
ISL6208IRZ-T7
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFN, SOIC
|
|
| Package Description |
SOP, SOP8,.25
|
,
|
| Pin Count |
8, 8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N8
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4.9 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Peak Current Limit-Nom |
4 A
|
4 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVQCCN
|
| Package Equivalence Code |
SOP8,.25
|
LCC8,.12SQ,25
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Turn-on Time |
0.03 µs
|
0.03 µs
|
| Width |
3.9 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Input Characteristics |
|
STANDARD
|
| Output Polarity |
|
TRUE
|
| Turn-off Time |
|
0.03 µs
|
|
|
|
Compare ISL6208IBZ with alternatives
Compare ISL6208IRZ-T7 with alternatives