ISL55110IRZ-T7
vs
ISL55110IRZ-T
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
,
|
HVQCCN, LCC16,.16SQ,25
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
4
|
| Part Package Code |
|
QFN, TSSOP
|
| Pin Count |
|
16, 8
|
| Factory Lead Time |
|
26 Weeks
|
| High Side Driver |
|
NO
|
| JESD-30 Code |
|
S-PQCC-N16
|
| Length |
|
4 mm
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Peak Current Limit-Nom |
|
3.5 A
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
HVQCCN
|
| Package Equivalence Code |
|
LCC16,.16SQ,25
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1 mm
|
| Supply Voltage-Max |
|
13.2 V
|
| Supply Voltage-Min |
|
5 V
|
| Supply Voltage-Nom |
|
12 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
4 mm
|
|
|
|
Compare ISL55110IRZ-T7 with alternatives
Compare ISL55110IRZ-T with alternatives