ISL55110IRZ-T13
vs
ISL55110IRZ
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
Package Description |
,
|
HVQCCN, LCC16,.16SQ,25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
QFN, TSSOP
|
Pin Count |
|
16, 8
|
Factory Lead Time |
|
78 Weeks
|
High Side Driver |
|
NO
|
JESD-30 Code |
|
S-PQCC-N16
|
Length |
|
4 mm
|
Number of Functions |
|
2
|
Number of Terminals |
|
16
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Peak Current Limit-Nom |
|
3.5 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
HVQCCN
|
Package Equivalence Code |
|
LCC16,.16SQ,25
|
Package Shape |
|
SQUARE
|
Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
1 mm
|
Supply Voltage-Max |
|
13.2 V
|
Supply Voltage-Min |
|
5 V
|
Supply Voltage-Nom |
|
12 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
NO LEAD
|
Terminal Pitch |
|
0.5 mm
|
Terminal Position |
|
QUAD
|
Width |
|
4 mm
|
|
|
|
Compare ISL55110IRZ-T13 with alternatives
Compare ISL55110IRZ with alternatives