ISL55110IRZ-T
vs
ISL55110IRZ-T7
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
QFN, TSSOP
|
|
| Package Description |
HVQCCN, LCC16,.16SQ,25
|
,
|
| Pin Count |
16, 8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| High Side Driver |
NO
|
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PQCC-N16
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
4 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Peak Current Limit-Nom |
3.5 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max |
13.2 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Supply Voltage-Nom |
12 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
|
|
|
Compare ISL55110IRZ-T with alternatives
Compare ISL55110IRZ-T7 with alternatives