ISL34341INZ
vs
ISL34340INZ-T13
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
INTERSIL CORP
|
| Part Package Code |
TQFP
|
QFP
|
| Package Description |
HTFQFP, TQFP64,.47SQ
|
TFQFP, TQFP64,.47SQ
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
| JESD-609 Code |
e3
|
|
| Length |
10 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HTFQFP
|
TFQFP
|
| Package Equivalence Code |
TQFP64,.47SQ
|
TQFP64,.47SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Current-Max |
90 mA
|
90 mA
|
| Supply Voltage-Max |
1.9 V
|
1.9 V
|
| Supply Voltage-Min |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
IT ALSO REQUIRES 3 TO 3.6 I/O SUPPLY
|
| Supply Voltage1-Max |
|
3.6 V
|
| Supply Voltage1-Min |
|
3 V
|
| Supply Voltage1-Nom |
|
3.3 V
|
|
|
|
Compare ISL34341INZ with alternatives
Compare ISL34340INZ-T13 with alternatives