ISL32457EIUZ-T7A
vs
ISL32457EIBZ-T13
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
MSOP, SOIC
|
|
| Package Description |
TSSOP, TSSOP8,.19
|
|
| Pin Count |
8, 8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ALSO OPERATES IN VCC 4.5 TO 5.5 V
|
|
| Differential Output |
YES
|
|
| Driver Number of Bits |
1
|
|
| Input Characteristics |
DIFFERENTIAL SCHMITT TRIGGER
|
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-422; EIA-485
|
|
| JESD-30 Code |
S-PDSO-G8
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Out Swing-Min |
1.1 V
|
|
| Output Low Current-Max |
0.005 A
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
TSSOP
|
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
325 ns
|
|
| Receiver Number of Bits |
1
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Current-Max |
4.5 mA
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Transmit Delay-Max |
1000 ns
|
|
| Width |
3 mm
|
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
|
|
|
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