ISL32374EIVZ
vs
ISL32374EFVZ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTERSIL CORP
|
| Package Description |
,
|
TSSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-10-10
|
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| JESD-609 Code |
e3
|
e3
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
16
|
| Differential Output |
|
YES
|
| Driver Number of Bits |
|
4
|
| Input Characteristics |
|
STANDARD
|
| Interface Standard |
|
EIA-422
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Length |
|
5 mm
|
| Moisture Sensitivity Level |
|
2
|
| Number of Functions |
|
4
|
| Number of Terminals |
|
16
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Transmit Delay-Max |
|
300 ns
|
| Width |
|
4.4 mm
|
|
|
|
Compare ISL32374EFVZ with alternatives