ISL32172EFVZ-T
vs
MC3553D
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC, TSSOP
|
|
| Package Description |
TSSOP, TSSOP16,.25
|
SOP,
|
| Pin Count |
16, 16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks
|
|
| Differential Output |
YES
|
YES
|
| Driver Number of Bits |
4
|
4
|
| Input Characteristics |
STANDARD
|
STANDARD
|
| Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
| Interface Standard |
EIA-422
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
|
| Length |
5 mm
|
9.9 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Out Swing-Min |
2 V
|
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP16,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
|
|
| Seated Height-Max |
1.2 mm
|
1.75 mm
|
| Supply Voltage-Max |
5.5 V
|
5.25 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transmit Delay-Max |
15 ns
|
15 ns
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare ISL32172EFVZ-T with alternatives
Compare MC3553D with alternatives