ISDMICROTAD-16MS vs ISD1620BSI01 feature comparison

ISDMICROTAD-16MS Winbond Electronics Corp

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ISD1620BSI01 Winbond Electronics Corp

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description 0.300 INCH, PLASTIC, SOIC-28 SOP, SOP16,.25
Pin Count 28 16
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G16
JESD-609 Code e0
Length 17.9 mm 9.9 mm
Number of Functions 1 1
Number of Terminals 28 16
Operating Temperature-Max 50 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP28,.4 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.75 mm
Supply Current-Max 40 mA 20 mA
Supply Voltage-Max (Vsup) 3.15 V 5.5 V
Supply Voltage-Min (Vsup) 2.85 V 2.4 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 3.9 mm
Base Number Matches 1 1
Application GREETING CARDS; TOYS; ANNUNCIATORS
On Chip Memory Type FLASH
Peak Reflow Temperature (Cel) 240
Reading Time-Max 40 s
Time@Peak Reflow Temperature-Max (s) 30

Compare ISDMICROTAD-16MS with alternatives

Compare ISD1620BSI01 with alternatives