ISD4003-06MSYI vs ISD4003-06MXYD feature comparison

ISD4003-06MSYI Nuvoton Technology Corp

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ISD4003-06MXYD Winbond Electronics Corp

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Part Life Cycle Code Active Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC DIE
Package Description SOP, SOP28,.4 DIE,
Pin Count 28 19
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-XUUC-N19
Length 17.93 mm
Number of Functions 1 1
Number of Terminals 28 19
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -20 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP28,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 360 s 360 s
Seated Height-Max 2.64 mm
Supply Current-Max 40 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.52 mm
Base Number Matches 2 2

Compare ISD4003-06MSYI with alternatives

Compare ISD4003-06MXYD with alternatives