ISD4003-04MXYI
vs
I17210PY
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
| Part Package Code |
DIE
|
DIP
|
| Package Description |
DIE,
|
DIP,
|
| Pin Count |
19
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
| JESD-30 Code |
R-XUUC-N19
|
R-PDIP-T28
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
19
|
28
|
| On Chip Memory Type |
FLASH
|
FLASH
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reading Time-Max |
240 s
|
420 s
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.4 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e3
|
| Length |
|
36.83 mm
|
| Seated Height-Max |
|
4.83 mm
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
15.24 mm
|
|
|
|
Compare ISD4003-04MXYI with alternatives
Compare I17210PY with alternatives