I17210PY vs ISD5008X feature comparison

I17210PY Winbond Electronics Corp

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ISD5008X Nuvoton Technology Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP INFORMATION STORAGE DEVICES
Part Package Code DIP DIE
Package Description DIP, DIE,
Pin Count 28 25
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDIP-T28 R-XUUC-N25
JESD-609 Code e3
Length 36.83 mm
Number of Functions 1
Number of Terminals 28 25
On Chip Memory Type FLASH
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Reading Time-Max 420 s
Seated Height-Max 4.83 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.4 V
Surface Mount NO YES
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Width 15.24 mm
Base Number Matches 1 2

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