ISD4003-04MEY vs ISD4003-04MEYD feature comparison

ISD4003-04MEY Nuvoton Technology Corp

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ISD4003-04MEYD Winbond Electronics Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Package Description TSSOP, TSSOP28,.53,22 TSOP1,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G28 R-PDSO-G28
Number of Terminals 28 28
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Equivalence Code TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 240 s 240 s
Supply Current-Max 40 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.55 mm 0.55 mm
Terminal Position DUAL DUAL
Base Number Matches 3 1
Part Package Code TSOP
Pin Count 28
Length 11.8 mm
Number of Functions 1
On Chip Memory Type FLASH
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.3 V
Supply Voltage-Min (Vsup) 2.7 V
Width 8 mm

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Compare ISD4003-04MEYD with alternatives