ISD4002-150X vs ISD4002-120EY feature comparison

ISD4002-150X Winbond Electronics Corp

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ISD4002-120EY Winbond Electronics Corp

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code DIE TSOP
Package Description DIE, TSOP1, TSSOP28,.53,22
Pin Count 19 28
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-XUUC-N19 R-PDSO-G28
JESD-609 Code e0
Number of Functions 1 1
Number of Terminals 19 28
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 50 °C 70 °C
Operating Temperature-Min
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSOP1
Package Equivalence Code DIE OR CHIP TSSOP28,.53,22
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 150 s 120 s
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 2 2
Length 11.8 mm
Seated Height-Max 1.2 mm
Supply Current-Max 40 mA
Terminal Pitch 0.55 mm
Width 8 mm

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