ISD4002-120EY
vs
ISD4003-04MXI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
WINBOND ELECTRONICS CORP
NUVOTON TECHNOLOGY CORP
Part Package Code
TSOP
DIE
Package Description
TSOP1, TSSOP28,.53,22
DIE,
Pin Count
28
19
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G28
R-XUUC-N19
Length
11.8 mm
Number of Functions
1
1
Number of Terminals
28
19
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSOP1
DIE
Package Equivalence Code
TSSOP28,.53,22
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
120 s
240 s
Seated Height-Max
1.2 mm
Supply Current-Max
40 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.55 mm
Terminal Position
DUAL
UPPER
Width
8 mm
Base Number Matches
2
2
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Compare ISD4003-04MXI with alternatives