ISD4003-04MXI
vs
ISD4003-04MXY
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NUVOTON TECHNOLOGY CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
DIE
Package Description
DIE,
DIE,
Pin Count
19
19
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-XUUC-N19
R-XUUC-N19
Number of Functions
1
1
Number of Terminals
19
19
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
85 °C
50 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Equivalence Code
DIE OR CHIP
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
240 s
240 s
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Base Number Matches
2
2
Compare ISD4003-04MXI with alternatives
Compare ISD4003-04MXY with alternatives