ISD1620BSI01
vs
I17180XY01
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
WINBOND ELECTRONICS CORP
|
WINBOND ELECTRONICS CORP
|
Part Package Code |
SOIC
|
DIE
|
Package Description |
SOP, SOP16,.25
|
DIE,
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Application |
GREETING CARDS; TOYS; ANNUNCIATORS
|
|
Consumer IC Type |
SPEECH SYNTHESIZER WITH RCDG
|
SPEECH SYNTHESIZER WITH RCDG
|
JESD-30 Code |
R-PDSO-G16
|
X-XUUC-N
|
Length |
9.9 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
|
On Chip Memory Type |
FLASH
|
FLASH
|
Operating Temperature-Max |
85 °C
|
50 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
DIE
|
Package Equivalence Code |
SOP16,.25
|
|
Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reading Time-Max |
40 s
|
360 s
|
Seated Height-Max |
1.75 mm
|
|
Supply Current-Max |
20 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ISD1620BSI01 with alternatives
Compare I17180XY01 with alternatives