ISD1616BSY
vs
ISD4003-06MPYI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
SOIC
DIP
Package Description
SOP,
DIP,
Pin Count
16
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-PDSO-G16
R-PDIP-T28
Length
9.9 mm
36.83 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
16
28
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
30 s
360 s
Seated Height-Max
1.75 mm
4.83 mm
Supply Voltage-Max (Vsup)
5.5 V
3.3 V
Supply Voltage-Min (Vsup)
2.4 V
2.7 V
Surface Mount
YES
NO
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
3.9 mm
15.24 mm
Base Number Matches
2
2
Package Equivalence Code
DIP28,.6
Technology
CMOS
Compare ISD1616BSY with alternatives
Compare ISD4003-06MPYI with alternatives