ISD1616BS vs ISD1616BSY feature comparison

ISD1616BS Nuvoton Technology Corp

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ISD1616BSY Winbond Electronics Corp

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NUVOTON TECHNOLOGY CORP WINBOND ELECTRONICS CORP
Package Description SOP, SOP16,.25 SOP,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Number of Functions 1 1
Number of Terminals 16 16
On Chip Memory Type FLASH FLASH
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Reading Time-Max 30 s 30 s
Supply Current-Max 20 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code Yes
Part Package Code SOIC
Pin Count 16
Length 9.9 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.75 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm

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