ISD1612BXY01
vs
I17210PY
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP,
Pin Count
16
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-XUUC-N16
R-PDIP-T28
Number of Functions
1
1
Number of Terminals
16
28
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
50 °C
70 °C
Operating Temperature-Min
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
24 s
420 s
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Surface Mount
YES
NO
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
1
JESD-609 Code
e3
Length
36.83 mm
Package Equivalence Code
DIP28,.6
Seated Height-Max
4.83 mm
Terminal Finish
MATTE TIN
Terminal Pitch
2.54 mm
Width
15.24 mm
Compare ISD1612BXY01 with alternatives
Compare I17210PY with alternatives