ISD1612BXY01
vs
I17210XYIR01
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
WINBOND ELECTRONICS CORP
WINBOND ELECTRONICS CORP
Part Package Code
DIE
DIE
Package Description
DIE,
DIE,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.4
Average Weight (mg)
2.9
CO2e (mg)
35.96
Category CO2 Kg
12.4
Compliance Temperature Grade
Commercial: +0C to +50C
EU RoHS Version
RoHS 2 (2011/65/EU)
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
Conflict Minerals Statement
Consumer IC Type
SPEECH SYNTHESIZER WITH RCDG
SPEECH SYNTHESIZER WITH RCDG
JESD-30 Code
R-XUUC-N16
X-XUUC-N
Number of Functions
1
1
Number of Terminals
16
On Chip Memory Type
FLASH
FLASH
Operating Temperature-Max
50 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
UNCASED CHIP
UNCASED CHIP
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Reading Time-Max
24 s
420 s
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
1
Compare ISD1612BXY01 with alternatives
Compare I17210XYIR01 with alternatives