IS62UT12816LL-100H
vs
IS62UT12816LL-55B
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
TSOP2
BGA
Package Description
STSOP2-44
MINI, BGA-48
Pin Count
44
48
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Commercial: +0C to +70C
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V4.01
Access Time-Max
100 ns
55 ns
JESD-30 Code
R-PDSO-G44
R-PBGA-B48
JESD-609 Code
e0
e0
Length
18.41 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX16
128KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
2 V
2 V
Supply Voltage-Min (Vsup)
1.6 V
1.6 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
Base Number Matches
1
1
kg CO2e/kg
12
Average Weight (mg)
141.6
CO2e (mg)
1699.2
Compare IS62UT12816LL-100H with alternatives
Compare IS62UT12816LL-55B with alternatives