IS62UT12816LL-100H
vs
HY62LF16406D-SF70I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
SK HYNIX INC
Part Package Code
TSOP2
BGA
Package Description
STSOP2-44
TFBGA, BGA48,6X8,30
Pin Count
44
48
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
70 ns
JESD-30 Code
R-PDSO-G44
R-PBGA-B48
JESD-609 Code
e0
e1
Length
18.41 mm
8 mm
Memory Density
2097152 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
48
Number of Words
131072 words
262144 words
Number of Words Code
128000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.1 mm
Supply Voltage-Max (Vsup)
2 V
2.7 V
Supply Voltage-Min (Vsup)
1.6 V
2.3 V
Supply Voltage-Nom (Vsup)
1.8 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.75 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
6 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA48,6X8,30
Standby Current-Max
0.000006 A
Standby Voltage-Min
1.5 V
Supply Current-Max
0.025 mA
Compare IS62UT12816LL-100H with alternatives
Compare HY62LF16406D-SF70I with alternatives