IS62UP6416SL-100BI vs PDM41532SA20TATY feature comparison

IS62UP6416SL-100BI Integrated Silicon Solution Inc

Buy Now Datasheet

PDM41532SA20TATY IXYS Corporation

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC IXYS CORP
Part Package Code BGA TSOP2
Package Description MINI, BGA-48 TSOP2,
Pin Count 48 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 20 ns
JESD-30 Code R-PBGA-B48 R-PDSO-G44
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.3 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL GULL WING
Terminal Position BOTTOM DUAL
Base Number Matches 1 1
Length 18.41 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm
Terminal Pitch 0.8 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 10.16 mm

Compare IS62UP6416SL-100BI with alternatives

Compare PDM41532SA20TATY with alternatives