IS61WV3216DBLL-10TLI
vs
IS64WV3216DBLL-10CTLA3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TSOP2,
TSOP2,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
10 Weeks
Samacsys Manufacturer
Integrated Silicon Solution Inc.
Access Time-Max
10 ns
10 ns
JESD-30 Code
R-PDSO-G44
R-PDSO-G44
Length
18.41 mm
18.41 mm
Memory Density
524288 bit
524288 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
44
44
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
32KX16
32KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
10.16 mm
10.16 mm
Base Number Matches
1
1
Compare IS61WV3216DBLL-10TLI with alternatives
Compare IS64WV3216DBLL-10CTLA3 with alternatives