IS61VF51236A-7.5TQVI
vs
R1Q3A3636ABG-33R
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, TQFP-100
|
15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165
|
| Pin Count |
100
|
165
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
7.5 ns
|
|
| Additional Feature |
PIPELINED ARCHITECTURE, FLOW-THROUGH
|
|
| JESD-30 Code |
R-PQFP-F100
|
R-PBGA-B165
|
| Length |
20 mm
|
17 mm
|
| Memory Density |
18874368 bit
|
37748736 bit
|
| Memory IC Type |
CACHE SRAM
|
QDR SRAM
|
| Memory Width |
36
|
36
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
165
|
| Number of Words |
524288 words
|
1048576 words
|
| Number of Words Code |
512000
|
1000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX36
|
1MX36
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFF
|
LBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.46 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
FLAT
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
14 mm
|
15 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e1
|
| Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare IS61VF51236A-7.5TQVI with alternatives
Compare R1Q3A3636ABG-33R with alternatives