R1Q3A3636ABG-33R vs IDT71V2548XS133PF feature comparison

R1Q3A3636ABG-33R Renesas Electronics Corporation

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IDT71V2548XS133PF Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS TECHNOLOGY CORP INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA QFP
Package Description 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165 LQFP,
Pin Count 165 100
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
JESD-30 Code R-PBGA-B165 R-PQFP-G100
JESD-609 Code e1 e0
Length 17 mm 20 mm
Memory Density 37748736 bit 4718592 bit
Memory IC Type QDR SRAM ZBT SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 165 100
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX36 256KX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LQFP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial SERIAL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.46 mm 1.6 mm
Supply Voltage-Max (Vsup) 1.9 V 3.465 V
Supply Voltage-Min (Vsup) 1.7 V 3.135 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position BOTTOM QUAD
Width 15 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Access Time-Max 4.2 ns
Additional Feature PIPELINED ARCHITECTURE
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare IDT71V2548XS133PF with alternatives