IS61VF204818A-7.5B3I
vs
MCM69F817ZP6
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
MOTOROLA INC
Part Package Code
BGA
BGA
Package Description
13 X 15 MM, PLASTIC, BGA-165
BGA,
Pin Count
165
119
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
6 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
117 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B165
R-PBGA-B119
JESD-609 Code
e0
e0
Length
15 mm
22 mm
Memory Density
37748736 bit
4718592 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
119
Number of Words
2097152 words
262144 words
Number of Words Code
2000000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
2MX18
256KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
2.4 mm
Standby Current-Max
0.145 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.35 mA
Supply Voltage-Max (Vsup)
2.625 V
3.6 V
Supply Voltage-Min (Vsup)
2.375 V
3.135 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
MOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
14 mm
Base Number Matches
1
4
Number of Ports
1
Output Enable
YES
Compare IS61VF204818A-7.5B3I with alternatives
Compare MCM69F817ZP6 with alternatives