IS61SF25632D-9B
vs
MT55L256L32FB-10
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-119
BGA,
Pin Count
119
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
9 ns
7.5 ns
Additional Feature
FLOW-THROUGH ARCHITECTURE
I/O Type
COMMON
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e0
Length
22 mm
22 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX32
256KX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA119,7X17,50
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.41 mm
2.4 mm
Standby Current-Max
0.03 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.35 mA
Supply Voltage-Max (Vsup)
3.63 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
2
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Compare MT55L256L32FB-10 with alternatives