IS61QDB41M18A-250B3L vs IS61QDB41M18A-250B3LI feature comparison

IS61QDB41M18A-250B3L Integrated Silicon Solution Inc

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IS61QDB41M18A-250B3LI Integrated Silicon Solution Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Package Description TBGA, BGA165,11X15,40 TBGA, BGA165,11X15,40
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Clock Frequency-Max (fCLK) 250 MHz 250 MHz
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18 1MX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40 BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.27 A 0.27 A
Standby Voltage-Min 1.7 V 1.7 V
Supply Current-Max 0.65 mA 0.65 mA
Supply Voltage-Max (Vsup) 1.89 V 1.89 V
Supply Voltage-Min (Vsup) 1.71 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 1 1

Compare IS61QDB41M18A-250B3L with alternatives

Compare IS61QDB41M18A-250B3LI with alternatives