IS61QDB41M18A-250B3LI
vs
IS61QDB41M18A-250M3L
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
TBGA, BGA165,11X15,40
LBGA, BGA165,11X15,40
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
Clock Frequency-Max (fCLK)
250 MHz
250 MHz
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
17 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX18
1MX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Standby Current-Max
0.27 A
0.27 A
Standby Voltage-Min
1.7 V
1.7 V
Supply Current-Max
0.65 mA
0.65 mA
Supply Voltage-Max (Vsup)
1.89 V
1.89 V
Supply Voltage-Min (Vsup)
1.71 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
15 mm
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
165
Factory Lead Time
28 Weeks
Additional Feature
PIPELINED ARCHITECTURE
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Compare IS61QDB41M18A-250B3LI with alternatives
Compare IS61QDB41M18A-250M3L with alternatives