IS61QDB22M18-250M3L vs IS61QDB22M18C-250M3L feature comparison

IS61QDB22M18-250M3L Integrated Silicon Solution Inc

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IS61QDB22M18C-250M3L Integrated Silicon Solution Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description 15 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-165 LBGA,
Pin Count 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Category CO2 Kg 12
Compliance Temperature Grade Commercial: +0C to +70C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2022-01-17
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V4.10
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e1 e1
Length 17 mm 17 mm
Memory Density 37748736 bit 37748736 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX18 2MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.7 mm 1.4 mm
Standby Current-Max 0.2 A
Standby Voltage-Min 1.71 V
Supply Current-Max 0.7 mA
Supply Voltage-Max (Vsup) 1.89 V 1.89 V
Supply Voltage-Min (Vsup) 1.71 V 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 10 30
Width 15 mm 15 mm
Base Number Matches 2 2

Compare IS61QDB22M18-250M3L with alternatives

Compare IS61QDB22M18C-250M3L with alternatives