IS61QDB22M18C-250M3L
vs
IS61QDB22M18A-250M3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Package Description
LBGA,
LBGA, BGA165,11X15,40
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
0.45 ns
0.45 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e1
Length
17 mm
17 mm
Memory Density
37748736 bit
75497472 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
18
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX18
2MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.89 V
1.89 V
Supply Voltage-Min (Vsup)
1.71 V
1.71 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
15 mm
15 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
165
Additional Feature
PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
SEPARATE
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Qualification Status
Not Qualified
Standby Current-Max
0.27 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.95 mA
Compare IS61QDB22M18C-250M3L with alternatives
Compare IS61QDB22M18A-250M3 with alternatives