IS49NLC18160-25EWBLI
vs
MT49H16M18SJ-25
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTEGRATED SILICON SOLUTION INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
TBGA,
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.28
|
8542.32.00.28
|
| Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
| Clock Frequency-Max (fCLK) |
400 MHz
|
400 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PBGA-B144
|
R-PBGA-B144
|
| Length |
18.5 mm
|
18.5 mm
|
| Memory Density |
301989888 bit
|
301989888 bit
|
| Memory IC Type |
DDR1 DRAM
|
RLDRAM2
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
95 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
16MX18
|
16MX18
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TBGA
|
| Package Equivalence Code |
BGA144,12X18,40/32
|
BGA144,12X18,40/32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Self Refresh |
YES
|
NO
|
| Sequential Burst Length |
2,4,8
|
2,4,8
|
| Standby Current-Max |
0.053 A
|
0.288 A
|
| Supply Current-Max |
0.98 mA
|
0.408 mA
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
AUTO REFRESH, TERM PITCH-MAX
|
| Interleaved Burst Length |
|
2,4,8
|
| JESD-609 Code |
|
e1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Refresh Cycles |
|
8192
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare IS49NLC18160-25EWBLI with alternatives
Compare MT49H16M18SJ-25 with alternatives