IS32WV16100A-70M vs MB82D01161-85LPBN feature comparison

IS32WV16100A-70M Integrated Silicon Solution Inc

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MB82D01161-85LPBN FUJITSU Limited

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC FUJITSU LTD
Part Package Code BGA BGA
Package Description BGA, TFBGA, BGA48,6X8,30
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 85 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e0
Memory Density 16777216 bit 16777216 bit
Memory IC Type PSEUDO STATIC RAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -30 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 2.2 V 2.7 V
Supply Voltage-Min (Vsup) 1.65 V 2.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Base Number Matches 1 2
Additional Feature ALSO OPERATES AT 2.7V TO 3.1V SUPPLY
I/O Type COMMON
Length 9 mm
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Seated Height-Max 1.2 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.025 mA
Supply Voltage-Nom (Vsup) 2.5 V
Terminal Pitch 0.75 mm
Width 6 mm

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Compare MB82D01161-85LPBN with alternatives