IS32WV16100A-70M
vs
IS65WV102416BLL-25MA3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
BGA
Package Description
BGA,
TFBGA, BGA48,6X8,30
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
25 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Memory Density
16777216 bit
16777216 bit
Memory IC Type
PSEUDO STATIC RAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
2.2 V
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
2.4 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
1
I/O Type
COMMON
Length
11 mm
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA48,6X8,30
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
Standby Current-Max
0.002 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.06 mA
Supply Voltage-Nom (Vsup)
3.3 V
Terminal Pitch
0.75 mm
Width
9 mm
Compare IS32WV16100A-70M with alternatives
Compare IS65WV102416BLL-25MA3 with alternatives