IS25CQ032-JGLA2
vs
M25P32-VMF3PBA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
MICRON TECHNOLOGY INC
Package Description
TBGA,
0.300 INCH, ROHS COMPLIANT, PLASTIC, SOP16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
104 MHz
75 MHz
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B24
R-PDSO-G16
Length
8 mm
10.3 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
16
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4MX8
4MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
SOP
Package Equivalence Code
BGA24,4X6,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
2.7 V
2.7 V
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
2.65 mm
Serial Bus Type
QSPI
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
DUAL
Type
NOR TYPE
NOR TYPE
Width
6 mm
7.5 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
2
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Time@Peak Reflow Temperature-Max (s)
30
Compare IS25CQ032-JGLA2 with alternatives
Compare M25P32-VMF3PBA with alternatives