IRFP360
vs
IRFM360R1
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
INTERNATIONAL RECTIFIER CORP
|
TT ELECTRONICS PLC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
|
Avalanche Energy Rating (Eas) |
1200 mJ
|
|
Case Connection |
DRAIN
|
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
400 V
|
400 V
|
Drain Current-Max (ID) |
23 A
|
23 A
|
Drain-source On Resistance-Max |
0.2 Ω
|
0.2 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-247AC
|
TO-254AA
|
JESD-30 Code |
R-PSFM-T3
|
S-MSFM-P3
|
JESD-609 Code |
e0
|
e1
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
METAL
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation Ambient-Max |
280 W
|
|
Power Dissipation-Max (Abs) |
280 W
|
|
Pulsed Drain Current-Max (IDM) |
92 A
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER
|
Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
4
|
1
|
Package Description |
|
FLANGE MOUNT, S-MSFM-P3
|
|
|
|
Compare IRFP360 with alternatives
Compare IRFM360R1 with alternatives