IRFM350
vs
IRFM350-JQR-BR1
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
TEMIC SEMICONDUCTORS
|
SEMELAB LTD
|
Package Description |
HERMETIC SEALED PACKAGE-3
|
FLANGE MOUNT, S-MSFM-P3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
400 V
|
400 V
|
Drain Current-Max (ID) |
15 A
|
14 A
|
Drain-source On Resistance-Max |
0.3 Ω
|
0.415 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JEDEC-95 Code |
TO-254AA
|
TO-254AA
|
JESD-30 Code |
S-MSFM-P3
|
S-MSFM-P3
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
METAL
|
METAL
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Terminal Form |
PIN/PEG
|
PIN/PEG
|
Terminal Position |
SINGLE
|
SINGLE
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Additional Feature |
|
HIGH VOLTAGE
|
Case Connection |
|
ISOLATED
|
JESD-609 Code |
|
e1
|
Operating Temperature-Max |
|
150 °C
|
Pulsed Drain Current-Max (IDM) |
|
56 A
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare IRFM350 with alternatives
Compare IRFM350-JQR-BR1 with alternatives