IRF130SMD05DSG-JQR-B
vs
IRF232
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
TT ELECTRONICS PLC
SAMSUNG SEMICONDUCTOR INC
Package Description
CHIP CARRIER, R-CBCC-N3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Case Connection
ISOLATED
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE
DS Breakdown Voltage-Min
100 V
Drain Current-Max (ID)
11 A
8 A
Drain-source On Resistance-Max
0.22 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code
TO-276AA
JESD-30 Code
R-CBCC-N3
Number of Elements
1
1
Number of Terminals
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
150 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Pulsed Drain Current-Max (IDM)
44 A
Qualification Status
Not Qualified
Surface Mount
YES
NO
Terminal Form
NO LEAD
Terminal Position
BOTTOM
Transistor Element Material
SILICON
Base Number Matches
2
11
Rohs Code
JESD-609 Code
e0
Power Dissipation-Max (Abs)
75 W
Terminal Finish
Tin/Lead (Sn/Pb)
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