IH5111MDE vs TDA1535B feature comparison

IH5111MDE General Electric Solid State

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TDA1535B NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer GENERAL ELECTRIC SOLID STATE NXP SEMICONDUCTORS
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type SAMPLE AND HOLD CIRCUIT SAMPLE AND HOLD CIRCUIT
JESD-30 Code R-XDIP-T16 R-PDIP-T16
JESD-609 Code e0
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -30 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Temperature Grade MILITARY OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code DIP
Pin Count 16
Acquisition Time-Nom 2 µs
Analog Input Voltage-Max 2.82 V
Length 19.09 mm
Neg Supply Voltage Limit-Max -6 V
Neg Supply Voltage-Nom (Vsup) -5 V
Sample and Hold / Track and Hold SAMPLE
Seated Height-Max 4.06 mm
Supply Voltage Limit-Max 6 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm

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