IDTQS3VH16233PAG
vs
74CB3Q3253DBQRE4
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
TSSOP
SOIC
Package Description
GREEN, TSSOP-56
SSOP, SSOP16,.25
Pin Count
56
16
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
BIDIRECTIONAL
Family
CB3Q/3VH/3C/2B
CB3Q/3VH/3C/2B
JESD-30 Code
R-PDSO-G56
R-PDSO-G16
JESD-609 Code
e3
e4
Load Capacitance (CL)
50 pF
Logic IC Type
BUS EXCHANGER
MULTIPLEXER AND DEMUX/DECODER
Moisture Sensitivity Level
1
2
Number of Bits
8
Number of Functions
2
2
Number of Inputs
1
1
Number of Outputs
2
4
Number of Ports
3
Number of Terminals
56
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Equivalence Code
TSSOP56,.3,20
SSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Packing Method
TUBE; TRAY
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
0.2 ns
Propagation Delay (tpd)
0.2 ns
0.18 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
1
Length
4.9 mm
Package Code
SSOP
Package Style
SMALL OUTLINE, SHRINK PITCH
Seated Height-Max
1.75 mm
Terminal Pitch
0.635 mm
Width
3.9 mm
Compare IDTQS3VH16233PAG with alternatives
Compare 74CB3Q3253DBQRE4 with alternatives