IDTQS3VH16233PAG vs 74CB3Q3253DBQRE4 feature comparison

IDTQS3VH16233PAG Integrated Device Technology Inc

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74CB3Q3253DBQRE4 Texas Instruments

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC TEXAS INSTRUMENTS INC
Part Package Code TSSOP SOIC
Package Description GREEN, TSSOP-56 SSOP, SSOP16,.25
Pin Count 56 16
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction BIDIRECTIONAL
Family CB3Q/3VH/3C/2B CB3Q/3VH/3C/2B
JESD-30 Code R-PDSO-G56 R-PDSO-G16
JESD-609 Code e3 e4
Load Capacitance (CL) 50 pF
Logic IC Type BUS EXCHANGER MULTIPLEXER AND DEMUX/DECODER
Moisture Sensitivity Level 1 2
Number of Bits 8
Number of Functions 2 2
Number of Inputs 1 1
Number of Outputs 2 4
Number of Ports 3
Number of Terminals 56 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code TSSOP56,.3,20 SSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Packing Method TUBE; TRAY
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 0.2 ns
Propagation Delay (tpd) 0.2 ns 0.18 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 1
Length 4.9 mm
Package Code SSOP
Package Style SMALL OUTLINE, SHRINK PITCH
Seated Height-Max 1.75 mm
Terminal Pitch 0.635 mm
Width 3.9 mm

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Compare 74CB3Q3253DBQRE4 with alternatives