IDTQS34XR245Q3
vs
SN74CBT32245GKER
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
BGA
Package Description
SSOP,
PLASTIC, LFBGA-96
Pin Count
80
96
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
BUS SWITCH
Family
CBT/FST/QS/5C/B
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G80
R-PBGA-B96
JESD-609 Code
e0
e0
Length
20.4978 mm
13.5 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
4
4
Number of Ports
2
2
Number of Terminals
80
96
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
LFBGA
Package Equivalence Code
SSOP80,.25,20
BGA96,6X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)
0.12 ns
0.35 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7526 mm
1.4 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
3.9116 mm
5.5 mm
Base Number Matches
3
1
Moisture Sensitivity Level
2
Peak Reflow Temperature (Cel)
235
Time@Peak Reflow Temperature-Max (s)
20
Compare IDTQS34XR245Q3 with alternatives
Compare SN74CBT32245GKER with alternatives