IDTCSPU877BV8
vs
MPC96877EP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
|
| Package Description |
VFBGA, BGA52,6X10,25
|
HVQCCN, LCC40,.24SQ,20
|
| Pin Count |
52
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CSPU877
|
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-XBGA-B52
|
S-XQCC-N40
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
6 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
| Max I(ol) |
0.009 A
|
0.009 A
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
52
|
40
|
| Number of True Outputs |
10
|
10
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA52,6X10,25
|
LCC40,.24SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.04 ns
|
0.04 ns
|
| Seated Height-Max |
1 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
4.5 mm
|
6 mm
|
| fmax-Min |
340 MHz
|
340 MHz
|
| Base Number Matches |
1
|
5
|
|
|
|
Compare IDTCSPU877BV8 with alternatives