IDTCSPU877BV8
vs
CDCU877RTBR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
QFN
Package Description
VFBGA, BGA52,6X10,25
QFN-40
Pin Count
52
40
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
CSPU877
877
Input Conditioning
DIFFERENTIAL
DIFFERENTIAL
JESD-30 Code
R-XBGA-B52
S-PQCC-N40
JESD-609 Code
e0
e4
Length
7 mm
6 mm
Logic IC Type
PLL BASED CLOCK DRIVER
PLL BASED CLOCK DRIVER
Max I(ol)
0.009 A
0.009 A
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
52
40
Number of True Outputs
10
10
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
HVQCCN
Package Equivalence Code
BGA52,6X10,25
LCC40,.24SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.04 ns
0.035 ns
Seated Height-Max
1 mm
0.9 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
20
30
Width
4.5 mm
6 mm
fmax-Min
340 MHz
340 MHz
Base Number Matches
1
1
Pbfree Code
ECCN Code
EAR99
Samacsys Manufacturer
Texas Instruments
Packing Method
TR
Compare IDTCSPU877BV8 with alternatives
Compare CDCU877RTBR with alternatives